Delyer Solder Paste
Delyer has developed several types of high-performance Delta Solder Paste designed for use in Sn/Pb or for Pb-Free circuit board assembly. Delyer Technology offers No-Clean, RMA (Rosin Mildly Activated), RA (Rosin Activated) and Water-Soluble solder paste types for surface mount assemblies. Delta Solder Paste types are available for printing, dispensing and package-on-package assembly. Delta Solder Paste is available in jars, syringes and Semco cartridges. | Product Brochure | Solder Paste Technical Data & SDS
| DELYER NO-CLEAN SOLDER PASTE | ||||
| Type | Process | Features | J-STD-004B | RoHs Compliant |
| DL670I | No-Clean | Robust Drop-in ready Sn/Pb paste with low residue and non-conductive residues | REL0 | No |
| DLXP692 | No-Clean | Excellent wettability, extended tack time, yields soft, non-tacky residues | REL0 | No |
| DL699 | No-Clean | Halogen-Free paste with excellent wetting and coalescence for fine pitch | ROL0 | No |
| DL825HF | No-Clean | Halogen-Free paste designed for fine pitch printing with excellent wetting and coalescence | ROL0 | Yes |
| DL863 | No-Clean | Halogen-Free technology, low voiding paste with excellent wettability | ROL0 | Yes |
| DL866 | No-Clean | Zero-halogen paste with light-colored, pin probable residues | ROL0 | Yes |
| DL875 | No-Clean | Halogen-Free formulation with superior low flux spatter | REL0 | Yes |
| DL615D | No-Clean | Dispensing solder paste with hard non-conductive residues | REL0 | No |
| DL618D | No-Clean | Specifically designed for Pb-Free applications, Easily dispensed for rework applications | ROL0 | Yes |
| DL619D | No-Clean | Dispensing solder paste with transparent, pin testable post soldering residues | REL0 | No |
| DELYER ROSIN-BASED SOLDRE PASTE | ||||
| Type | Process | Features | J-STD-004B | RoHs Compliant |
| DL230 | RMA | RMA solder paste that meets no-clean requirements, Excellent soldering performance for both Sn/Pb and lead-free applications | ROM0 | No/Yes |
| DL215D | RMA | Dispensing RMA solder paste with hard, non-conductive residues | ROM0 | No/Yes |
| DL350 | RA | Robust Sn/Pb formulation for Sn/Pb and lead-free applications | ROM1 | No/Yes |
| DL315D | RA | Dispensing solder paste with excellent wettability | ROM0 | No/Yes |
| DELYER HALOGEN-FREE SOLDER PASTE | ||||
| Type | Process | Features | J-STD-004B | RoHs Compliant |
| DL699 | No-Clean | Halogen-Free paste with excellent wetting and coalescence for fine pitch | ROL0 | No |
| DL825HF | No-Clean | Halogen-Free paste designed for fine pitch printing with excellent wetting and coalescence | ROL0 | Yes |
| DL863 | No-Clean | Halogen-Free technology, low voiding paste with excellent wettability | ROL0 | Yes |
| DL866 | No-Clean | Zero-halogen paste with light-colored, pin probable residues | ROL0 | Yes |
| DL875 | No-Clean | Halogen-Free formulation with superior low flux spatter | REL0 | Yes |