Delyer Senju solder paste

LS720V Series

• Halogen-free is also available.
• The equivalent profile of M705 (SAC305) can be applied to M40-LS720V.
• Joint reliability of Sn-Cu solder is enhanced through the addition of materials such as Ag, Bi and/or Ni.

145HF Series

• Environmentally friendly by reducing over 20% of power consumption.
• Component friendly for low heat-resistant components and substrates.
• Newly developed “L29” alloy satisfied drop and thermal fatigue resistance.

　

6 months refrigerated storage

Good wettability on various base metals

Updated universal solder paste

• Improved printability and wettability.
• Suppresses BGA Non-Wet Open (NWO) and voids.

Improved stencil life by suppressing the reaction between solder powder and flux

GLV Series

Excellent void suppression

• Suppresses voids with our original methods.
• Improved wettability enables the soldering of easily oxidized materials.

Void suppression process

WSG70 Series

Water soluble solder paste

• Flux residue cleanable with 60 ℃ hot water.
• Available with fine pitch.
• Halogen free.

Cleaned flux residue

Suppressed hot slump enabling fine pitch soldering

NSV320 Series

Solder paste for transfer method

• Avoids Non-Wet-Open (NWO) and Head-in-Pillow (HiP).
• Improved transferability ensures the amount of solder.

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