DSP-637 no-clean solder paste series, which are made from solder paste and sphere solder powder of low oxidation with scientific formula, are developed and designed for SMT no-clean process. Owning very good printing performance, suitable for SMT of fine pitch device; The DSP-637  solder paste series are formulated by low corrosivity activators, meeting the SMT no-clean technique requirements with the features of nearly no dross, low corrosivity and high insulation resistance.

1 The raw materials of the flux are natural resin or plants, easily biodegrading, without F or other materials harmful to the environment.
2 Moderate viscosity, good thixotropy, not easy to slump after printing

3 Suitable for technique such as injection and stencil printing, good wettability on substrate of different materials.

4 Excellent soldering performance in wide range of reflow soldering temperature.

5 After soldering, bright joint color, no-residue, no corrosion to the PCB, high surface insulation resistance,

6 Very good ICT test performance without cleaning.，avoiding erroneous judgement.

Solder Alloy Powder Element		Sn63Pb37
Solder Powder Specs		-325+500（25～45μm）
Alloy Content		89﹪
Melting Point		183℃
Copper Mirror Corrosion		PASS
Copper Mirror Corrosion		PASS
Slump Test		PASS
（SIR）	Initial Value	1.0×1013Ω
	After HT and High Humidity	1.0×1011Ω
Rate of expansion		89%
Viscosity retention		6～8 H
viscosity		180±10%pa·s
Packing		500g/jar